MarrFill Levelprimer EC

Scraping layer

Product Information

Product Description

MarrFill Levelprimer EC is a filled, two-component epoxy resin scraping layer with excellent adhesion on various substrates. This product can be applied to the hardened MarrFill Floorprimer EC, is solvent-free and is very suitable for filling and leveling holes and irregularities.

Properties

Consumption & Packaging

Usually ca. 1,8 kg/mm²/mm layer thickness
Sets of 15 kg

Application

Easy to apply. Clean tools with CorrFill Thinner DLT after use.

Technical Information

Technical Data

Material
Filled epoxy spatula
Density (20°C)
1,8 kg/ltr
Viscosity (23°C)
ca. 1100 mPa:s (comp A)
ca. 170 mPa:s (comp B)
Drying times (20°C / 50% R.H.)
Walkable after 14 hours
Mechanically resistant after 24 hours
Chemically resistant after 7 days
Processing time (20°C)
40 minutes
Shore D-hardness
ca. 83
Mixing ratio
2:1 parts by weight
Epoxy resin-filler ratio
1:2 parts by weight
Compressive strength
ca. 100 N/mm² (DIN EN 196-1)
Bending tensile strength
ca. 40 N/mm² (DIN EN 196-1)
Adhesion strength
> 3,8 N/mm² (break in concrete)
Application conditions
minimally 8°C, optimally 15°C - 25°C
HS Code
29072300 (comp A)
29212100 (comp B)
UN-code
3082 (comp A)
2735 (comp B)

Project Detailing

Surface Preparation

Substrate Requirements

01

Ensure that the substrate is coherent, absorbent, and dry.

Surface Preparation

02

For smooth, dense, or cement-rich substrates, always roughen the surface to improve adhesion.

Adding Filler

03

After mixing the components, slowly add the filler while continuing to mix until a homogeneous mass is obtained.

Sustainability & Storage

MarrFill Levelprimer EC has a shelf life of 12 months, provided that opened buckets are properly closed and stored frost-free, not in direct sunlight, between 5°C and 25°C.

Additional Products

Additional Products

MarrFill Floorprimer EC

Primer

Projects

Do you want to know where
we apply our coatings ?

Quality

We strive to work with high-quality products and safe working methods.